The technology cluster "Laser" is divided into four sub-clusters:
- Selective Laser Melting (SLM)
- Laser Cladding
- Process Monitoring
- Laser Ablation
As an overall goal, the technology cluster »Laser« aims to develop methods to adapt machining strategies, independent of working material, geometry and function, for SLM and Laser Cladding.
For SLM, this goal shall be pursued by observing the complete manufacturing chain from component design via adapted processing strategies and process parameters all the way to identifying specific mechanical values and post-processing.